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High-purity Copper Planar Target and Rotary Target

For flat panel displays, sputtering targets are mainly used in the production of display panels and touch screen panels. The main types of targets used include molybdenum targets, aluminum targets, aluminum alloy targets, chromium targets, copper targets, copper alloy targets, silicon targets, titanium targets, niobium targets and indium-tin oxide (ITO) targets.

Product Description

產(chǎn)品用途：

用作承擔(dān)信號(hào)傳輸?shù)腡FT電極布線材料。

Application:

It is used as TFT electrode wiring material for signal transmission.

產(chǎn)品性能參數(shù)/Product Property Parameters:

化學(xué)成分 Chemical Compositions
主含量，（%，不小于） Main Content, %, min	Cu	99.995
雜質(zhì)含量（質(zhì)量分?jǐn)?shù)），（%, 不大于） Impurity Content (mass fraction), %, max	P	0.0003
	Sb	0.0004
	As	0.0005
	Bi	0.0001
	Cd	0.0001
	Fe	0.0010
	Pb	0.0005
	Mn	0.0005
	Ni	0.0010
	Se	0.0003
	Ag	0.0025
	S	0.0015
	Te	0.0002
	Sn	0.0002
	Zn	0.0001
	O	0.0005
注：銅含量為100%減去表中所列雜質(zhì)元素實(shí)測(cè)含量的總和（不包含氣體元素）；需方如有特殊要求時(shí)，由供需雙方協(xié)商確定，并在合同或訂貨單中注明。 Note: Copper content is the sum of 100% minus the measured content of impurity elements listed in the table (excluding gas elements). Special requirements will be agreed upon by the supplier and buyer, and indicated in the contract or purchase order.

其他性能Other properties:

牌號(hào)

Grade

密度

Density

(g/cm³)

平均晶粒尺寸Average Grain Size (μm)

粗糙度Roughness

(μm)

直線度Straightness

(mm)

貼合率Bonding Rate

≥8.94

≤100

≤0.8

≤0.30

≥97%

尺寸Size:

形狀Shape	產(chǎn)品世代	靶材尺寸（mm）
平面 Planar	G6	230019016
	G8.5	265021018
	G10.5	343020020
旋轉(zhuǎn) Rotary	G6	φ135/167*2158
旋轉(zhuǎn) Rotary	G8.5	φ135/167*2692