產(chǎn)品用途：
用作承擔(dān)信號傳輸?shù)腡FT電極布線材料。
Application:
It is used as TFT electrode wiring material for signal transmission.
產(chǎn)品性能參數(shù)/Product Property Parameters:
|
化學(xué)成分
Chemical Compositions
|
|
主含量，（%，不小于）
Main Content, %, min
|
Cu
|
99.995
|
|
雜質(zhì)含量
（質(zhì)量分?jǐn)?shù)），
（%, 不大于）
Impurity Content (mass fraction), %, max
|
P
|
0.0003
|
|
Sb
|
0.0004
|
|
As
|
0.0005
|
|
Bi
|
0.0001
|
|
Cd
|
0.0001
|
|
Fe
|
0.0010
|
|
Pb
|
0.0005
|
|
Mn
|
0.0005
|
|
Ni
|
0.0010
|
|
Se
|
0.0003
|
|
Ag
|
0.0025
|
|
S
|
0.0015
|
|
Te
|
0.0002
|
|
Sn
|
0.0002
|
|
Zn
|
0.0001
|
|
O
|
0.0005
|
|
注： 銅含量為100%減去表中所列雜質(zhì)元素實(shí)測含量的總和（不包含氣體元素）；需方如有特殊要求時，由供需雙方協(xié)商確定，并在合同或訂貨單中注明。
Note: Copper content is the sum of 100% minus the measured content of impurity elements listed in the table (excluding gas elements). Special requirements will be agreed upon by the supplier and buyer, and indicated in the contract or purchase order.
|
其他性能Other properties:
|
牌號
Grade
|
密度
Density
(g/cm3)
|
平均晶粒尺寸Average Grain Size (μm)
|
粗糙度Roughness
(μm)
|
直線度Straightness
(mm)
|
貼合率Bonding Rate
|
|
Cu
|
≥8.94
|
≤100
|
≤0.8
|
≤0.30
|
≥97%
|
尺寸Size:
|
形狀Shape
|
產(chǎn)品世代
|
靶材尺寸（mm）
|
|
平面
Planar
|
G6
|
2300*190*16
|
|
G8.5
|
2650*210*18
|
|
G10.5
|
3430*200*20
|
|
旋轉(zhuǎn)
Rotary
|
G6
|
φ135/167*2158
|
|
G8.5
|
φ135/167*2692
|
